Product Information
Developing, Etching and Peeling
Silicon Wafer Etcher of Batch-Type
This machine removes damage of grinded wafer.
Application
Damage removal of grinded wafer
Object wafer size：～12 inch (300mm）
Characteristics
- Damage removal by alkaline (KOH) etchant uniformly
- 25 / 50 pcs batch method
- Reduction of chemical waste