Demonstration

Instruction of Demonstration Equipment

• 

  Grinding

  DMG-6011V

  • Grinding test of difficult-to-cut materials - SiC, Sapphire, GaP etc...
  • Object size of wafer 4inch～12inch
  • It is able to test not only round wafer but also special shape wafer such as square.
  • We prepare for grindstone from #180 to #8000.

• 

  Polishing

  LGP-712

  • Object size of wafer is 12inch
  • It is able to do polishing experiment by 200μm of thickness.
  • It has 2 shafts, air cylinder type. It is possible to set dresser on 1 shaft and do dress during processing.
  • Ceramic heads, air back heads and polishing cloths are prepared.

• 

  Polishing

  MGP-15S I

  • One side lapping / polishing machine
  • Object size of wafer　1inch～5inch
  • Polishing tests of difficult-to-cut materials - SiC、sapphire, GaP

• 

  Cleaning

  Lift off machine（HPMJ)

  • Ultrahigh-pressure micro jet cleaning unit.
  • Object substrate　100×100mm～200×200mm
  • It corresponds not only DIW but also organic solvent.

• 

  Etching

  Slit Coater

  • Object size of substrate is maximum 400×500mm
  • It is able to experiment slit & spin process by combining with demo machine of spin coater.

• 

  Etching

  Open Type Spin Coater

  • Object size of substrate　150×150mm　～　200×200mm
  • Maximum rotational speed：5000rpm
  • It corresponds resists of high viscosity

• 

  Etching

  Close Type Spin Coater

  • Object size of substrate　270×270mm　～　300×400mm
  • Maximum rotational speed：1200rpm
  • It is optimal for test of film thickness uniformity.

• 

  Dry

  Hot Plate

  • Object size of substrate　50×50mm　～　300×400mm
  • Temperature　RT　～　200℃
  • It is able to experiment of baking after coating process with demo machine of coater.

• 

  Visual Inspection

  Wafercom

  • Object size of wafer：12inch
  • Measurement contents : Thickness, Flatness、Warp、CBIR、SBIR、SFQR
  • Measurement range : 770μm　～　1500μm
  • It is able to measure bonded wafer, quartz and glass wafer.