About Micro Engineering, Inc.

Fully automatic CMP machines "MGP808XJ" is a successor model of "LGP-808XJ" made by the Lap Master SFT. We adapt new heads which we developed, and it has been achieved to improve GBIR and SFQR of wafer's surface which is increasing year by year.

The automatic packaging machine (MP300) transports the wafer cassette (FOSB) placed at the loading location (loader section) to the inspection area. In the inspection area, FOSB are inspected by conducting hosted communications. The inspection contents are FOSB type, confirmation of wafer position and inspection of the number of wafers. In the packaging area, one-or two-tier packaging is conducted. By automating the visual inspection and packaging work that was conventionally performed manually, it is possible to reduce human error, shorten the work time, and make the packaging quality uniform.

The wafer defect inspection machine (MICW300) takes out the wafer from the BOX which set by OHT or operator at the load port (FOSB opener) and inspects at each position.
Store OK products transfer to the original place and NG products transfer to the NG BOX.
In addition, automation from conventional visual inspection can reduce human error and save waste time.

Previous hand dryers used to spray and dry water droplets and dust into the air. CIRCULA has been developed as the only aspiration-type hand dryer in the country and prevents the dispersion of waterdrops, miscellaneous fungal, viruses, etc. by 99.7% compared to conventional ones. ※１
Compared to the conventional hand dryer whose temporary use was prohibited by COVID-19, CIRCULA is expected as a countermeasure against infectious diseases because it prevents the spread of viruses.

※1:Comparison time at 40cm point above the discharge port of the hand dryer for 10 seconds