Product Information
Developing, Etching and Peeling
Single-Wafer Spin Processor (ATOM)
Wet Processor of Silicon Wafer
Application
It can correspond to various processes.
Object wafer Size:~12 inch (300mm)
Characteristics
- It is possible to treat and recover separately for multiple in 1 chamber.
- Bernoulli method chuck implements non-contact transfer and processing.
- Individual chemical supply system