Developing, Etching and Peeling

Single-Wafer Spin Processor (ATOM)

Wet Processor of Silicon Wafer

Application

It can correspond to various processes.
Object wafer Size:~12 inch (300mm)

Characteristics

It is possible to treat and recover separately for multiple in 1 chamber.
Bernoulli method chuck implements non-contact transfer and processing.
Individual chemical supply system

Inquiries

Please feel free to contact us.