Fully automatic flatness measuring equipment (WAFERCOM)

Flatness Measuring Machine of Silicon Wafer

Application

This machine inspects thickness and flatness of the wafer.
Object wafer Size：8 inch / 12 inch
It corresponds to the bonded wafer.

Characteristics

It measures thickness, warpage and flatness of wafer by non-contact sensor (up and down pinching).: (Parameter：GBIR、SBIR、SFQR、BOW/WARP etc.）
It uses physical characteristics of the natural stone, micro-granite (black granite).