Product Information
Wafer defect inspection Machine
Wafer defect inspection Machine
The wafer defect inspection Machine (MICW300) takes out the wafers in the BOX set by the OHT or the operator at the load port (FOSB opener) and inspects each inspection section. The OK products are stored in the NG box in the original location.
In addition, automation from conventional visual inspection can reduce human error and save waste time.
Application
Automate traditional visual inspection.
Detects defects such as pinholes, cracks, scratches, and scratches in chemical wafers
Characteristics
- Space-saving by C back C transfer system
- It is possible to select whether the NG product is returned to the original cassette or transferred to the NG-dedicated cassette.
- Target wafer size: Compatible with 6 to 12 inch※1
- ※1 There is only one size. size cannot be mixed.
- Storage of image as a result of inspections of OK products and NGs is also possible.
Machine specification
- Machine dimensions
- 3750D×2800W×2315H
- Power supply
- AC200V Φ3 50Hz 30KVA
- CDA
- 100NL/min
- Exhaust
- 5m3/min×2 locations
- Cycle time
- Approx. 20sec（varies with test settings）