Product Information
Grinding
Research and Development for the Grinder (DMG-6011V)
It is a grinding machine for Difficult-to-cut materials such as SiC and sapphire.Manual type is ideal for development use.
Application
It is a single wafer grinding machine for research and development.
It grinds for brittle materials such as silicon and SiC.
Characteristics
- It enables to process brittle materials such as SiC, sapphire, Gan etc...
- It shorten the processing time of difficult-to-cut materials with a high rigidity mechanical spindle