Product Information
Polishing machine
Precision Lapping Machine (KLP-40DXFP)
It is for rough polishing (lapping) to improve wafer's parallelism and the uniformity of thickness.In addition to the silicon wafers, it also enables a variety of processing such as difficult-to-cut and curable materials.
Application
It is for processing silicon and brittle materials such as SiC.
Characteristics
- It polishes difficult-to-cut and curable materials such as GaN, SiC and sapphire.
- It improves the surface roughness by various surface plates such as Cu, Sn and blowing agent.
- And it maintains the shape of the surface plates. (Lapping plate maintaining mechanism)