Fully Automatic CMP Machine (MGP708XJ)

The fully automated CMP machine was developed as a successor to LGP-708XJ manufactured by Lap Master SFT. We adapt new heads which we developed, and it has been achieved to improve GBIR and SFQR of wafer's surface which is increasing year by year.

Characteristics

Achieve high throughput with a total of 8 axes of polishing heads and 3 tables

Edge clamping system is adopted for the robot hand to be transported.

Unloaders can be dried out by joining with cleaning machines

※Wet-out by wet cart can also be selected.

Machine specification