Product Information
Grinding
Fully Automatic Grinder and Polisher of Wafer (CMG-802XJ)
It is the fully automatic composite machine of grinding and polishing which performs the chuck surface cleaning, rough grinding, final grinding and polishing in one machine.
Application
It archives fully automated machine of grinding, polishing, dicing frame supply, tape mount and demount process.
Characteristics
- It enables to grind 8" / 12" wafer's thickness into 30um
- It is integrated machine including a tape mount / demount equipment.