Product Information
FA related product
FOSB Automatic Packing Machine (MAP300)
The automatic packaging machine (MP300) transports wafer cassettes (FOSB) placed in the loading area (loader section) by the operator to the inspection area. At the inspection area, the FOSB is inspected through host communication. The inspection includes the FOSB type, wafer position, and number of wafers. In the packaging area, single or double packaging is performed.
By automating visual inspection and packaging operations that were previously performed manually, human error can be reduced, work time can be shortened, and packaging quality can be made more uniform.
Application
Packaging between semiconductor manufacturing processes, shipping packaging
Characteristics
- Flexible number of storage boxes for loaders and unloaders
- The number of storage units for loading and unloading can be set to reduce the operator's workload and improve efficiency.
- BOX type and number of wafers inside can be detected and confirmed by our unique technology.
- Label can be affixed at the designated location
- Silica gel can be loaded into the packaging and deaerated packaging is possible.
Machine specification
- Machine dimensions
- 3830D×2430W×2600H(Inspection and packaging unit)
- Power supply
- AC208V Φ3 50Hz 44KVA
- CDA
- 250NL/min
- N2
- 130NL/min
- cycle time
- Approx.120~Approx.270sec(varies with test settings)